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           Samsung Electronics Develops World's First Next-Generation
                          Wafer Processing Technology

SEOUL, Korea - September, 14, 1998 - Samsung Electronics Co. Ltd. has  completed
development of  a  multi-layer  circuit  production  process  that  uses  Fully-
-Depleted-Silicon-On-Insulator (FD-SOI) elements, which involve wafer processing
technology that can create next-generation, super-fast CPUs.  FD-SOI  production
technology is a core technology for reducing power consumption  while  improving
signal transmission speed. Little additional  design  modification  is  required
when designing devices using highly complex processing technology. A high degree
of integration is possible, circuit design is easy and FD-SOI can be applied  to
existing products without having to make design changes.  With  SOI  technology,
chips can operate with a  power  supply  of  one  volt  only,  facilitating  the
production of systems that  are  fast,  energy-efficient  and  operable  on  low
voltage. Chip size can be reduced and  production  processes  simplified,  which
translate into lower production costs.

Moreover, Samsung Electronics has developed various  cutting-edge  processes  to
enhance  speed  and  reduce  power  consumption.   These   include   microscopic
lithography, trench isolation, 4-nanometer-thick gate oxide film, low-resistance
transistors, 4-layer and higher circuitry, and low-dielectric thin film.

FD-SOI  can  be  applied  to  existing  products  without  new  investments   in
facilities. This means greater price competitiveness in the marketplace. Process
technology for 0.25-micron circuitry is used, and CPUs with operating speeds  of
1-gigahertz and higher can be produced.  Chips  made  with  FD-SOI  operate  25%
faster than other chips, so this technology can be  applied  to  next-generation
Alpha CPUs.

FD-SOI technology will also be applied to copper chips, which are scheduled  for
completion next year. This technological marriage is expected to result in chips
that have 0.18-micron circuits and that operate at 1.5 gigahertz or higher.


Copper Chip: Transistor connectors will be made of copper instead  of  aluminum,
increasing signal process speed while reducing production costs.

Microscopic Lithography: A 0.25-micron krypton fluoride (KrF) laser is  used  to
etch circuit patterns onto the wafer surface.

Trench Isolation: Implementing electric circuits  involves  connecting  isolated
devices through specific conducting paths. Thus, to fabricate monolithic-silicon
IC's, devices  isolated  from  one  another  must  be  created  in  the  silicon
substrate. A variety of techniques have been developed  to  isolate  devices  in
IC's. However, during this FD-SOI project, new trench isolation  technology  was
developed for  minimizing  residual  stress  of  SOI  devices.  Here,  a  trench
isolation is first etched in the thin film Si  on  SOI,  and  refilled  with  an
insulator material. Then the surface is planarized by a mechanical and  chemical
polishing process.

Low-Resistance Transistors: A great deal  of  Samsung  know-how  has  gone  into
transistor technology, a core part of the FD-SOI  project.  Samsung  Electronics
developed a  super-thin  cobalt  silicide  (conductor)  film  process  to  lower
resistance of the transistor gate,  source  and  drain.  The  process  maximizes
transistor performance.

4-Layer (or  more)  Circuitry:  Samsung  Electronics  has  already  secured  the
capability to make 4-layer circuitry, and the company expects to have  circuitry
of six layers or more by the time mass production begins. Currently, the company
is applying its 0.25-micron design rule.

Low-Dielectric Thin Film: The latest technology  is  applied  to  low-dielectric
thin film, used as insulation between circuit layers.

In Samsung Electronics Co., Ltd, there are three main business units:

- Multimedia & Home Appliances

- Semiconductors

- Information & Telecommunications

Samsung Electronics Co., Ltd, a  US  $13  billion  (1997)  flagship  company  of
Korean-based Samsung Group, is a world leader in electronics, with operations in
more than 60 countries and 85,000 employees worldwide.
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